• Ultra-Thin Gap Filling: Ideal for minimal interface gaps (<100μm) between heat sources and cooling elements.
• Low Thermal Resistance: Minimizes contact thermal resistance at the interface.
• Controlled Bond Line Thickness (BLT): Achieves optimal thin layer formation under specified clamping pressure.
• High Conformability: Low viscosity ensures complete micro-void filling on uneven surfaces.
• Non-Curing Formulation: Ready-to-use without curing processes.