• Ultra-Thin Gap Filling: Ideal for minimal interface gaps (<100μm) between heat sources and cooling elements.

• Low Thermal Resistance: Minimizes contact thermal resistance at the interface.

• Controlled Bond Line Thickness (BLT): Achieves optimal thin layer formation under specified clamping pressure.

• High Conformability: Low viscosity ensures complete micro-void filling on uneven surfaces.

• Non-Curing Formulation: Ready-to-use without curing processes.

• Breakthrough Thermal Conductivity: Delivers next level of thermal conductivity than conventional thermal greases

• Engineered Thermal Performance: Ultra-low interfacial thermal resistance with high bulk conductivity - Our next-generation TIM solution

• Irregular Surface Adaptation: Engineered for non-uniform gaps between heat-generating components and heatsinks where conventional TIMs fail.

• Ready-to-Use Non-Curing Compound: Single-component formula maintains permanent plasticity to conform to surface irregularities.

• Zero Slump or Flow Issues: Exhibits stable dimensional integrity during operation and storage.

• Deep Penetration Capability: Low viscosity with strong wicking action fills intricate gaps between components and wiring harnesses.

• Optimized Gap Filling: Designed for component-to-heatsink gaps of 0.2–2mm - ideal where thermal grease is impractical.

• Engineered Processability: Die-cuttable with easy manual/automated installation.

• Clean Manufacturing Compliant: Zero silicone oil bleed-out contaminating work surfaces.

• Purpose-engineered thermal management material providing triple-barrier protection against moisture ingress, dust contamination, and mechanical impact for sensitive electronics.