Product description

DY-PD series soft material thermal pad. Excellent thermal conductivity, slightly self-adhesive, no need for adhesive backing.

Product Features

• Low-Compression Resilience: Maintains thermal performance under minimal pressure

• Superior Gap Conformity: Seamlessly fills microscopic surface irregularities

• Long-Term Chemical Integrity: Exceptional stability across thermal cycles

Product Application

• 5G & Communication Systems

• Automotive Lighting Modules

• Ruggedized Vehicle Electronics

• EV Charging Infrastructure

• Server & Data Center Hardware

• Enterprise Storage Solutions