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Thermal pad

Thermal pad

此处为对应的简介

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Product description

DY-PD series soft material thermal pad. Excellent thermal conductivity, slightly self-adhesive, no need for adhesive backing.

Product Features

• Low-Compression Resilience: Maintains thermal performance under minimal pressure

• Superior Gap Conformity: Seamlessly fills microscopic surface irregularities

• Long-Term Chemical Integrity: Exceptional stability across thermal cycles

Product Application

• 5G & Communication Systems

• Automotive Lighting Modules

• Ruggedized Vehicle Electronics

• EV Charging Infrastructure

• Server & Data Center Hardware

• Enterprise Storage Solutions

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