Underfill

CN-1738

90

60

300

YES

Suitable for CSP and BGA packaging, fast curing at low temperature, good fluidity, the adhesive has excellent adhesion to organic substrates.

CN-1780-5

119

32

3800

YES

Suitable for BGA, WL-CSP packages, fast flow to improve shock and vibration performance, and thermal cycle performance. Its maximum particle size is 10 microns and can fill gaps of 0.5 microns. The adhesive has excellent adhesion to organic substrates.

X2852C

65

25

6000

NO

An underfill encapsulant suitable for wafer-level packaging and BGA packaging. It can be cured quickly at low temperature and has fast fluidity. This encapsulant has excellent adhesion to organic substrates.

Edgebond adhesive

UA-2605-B

134

30

220,000

YES

Suitable for BGA, CSP, and other surface mount components, this glue can improve the thermal cycle performance of CBGAs and BGAs, and its heat-resistant cycle (0°C ~ +100°C) performance has been tripled to 2,500 cycles, low temperature fast solidified.