Rosin Base

JS-E-11

• Optimized for Lead-Free Alloys: Formulated for Sn-Ag-Bi-Cu solder systems.

• Superior Solderability Performance: Ensures bridging-free joints, eliminates skipped joints, and achieves complete through-hole fill.

• Ultra-Low Post-Reflow Residue: Provides minimal, easily cleanable flux residues after reflow, ensuring clean assemblies.

Low organic acid-base solid (ORL0) type

JS-EU-01

• Solid Content: 4.0%

• Superior Wettability & Penetration: Ensures optimal flow into critical micro-joints

• Ultra-Low Post-Reflow Residue: Minimal cleanable flux residue after reflow

Low organic acid-base solid (ORL0) type

JS-EU-31

• Halogen-Free Compliance & Composition: BS EN14582 compliant (Cl+Br < 900ppm) | Solid Content: 2.7%

• Superior Flow Performance: Exceptional wettability with deep micro-joint penetration

• Versatile Process Compatibility: Engineered for wave soldering and selective soldering processes