Product description

DY-PA series thermal conductive sealant is a thermal conductive material specially designed to protect components from external environmental influences such as moisture, dust, and impact.

Product Features

• Versatile Curing: Room-temperature or heat-accelerated options

• Optimized Pre-Cure Flow: Low viscosity with rapid deairing

• Enhanced Post-Cure Properties: Integrated thermal conductivity, electrical insulation, and impact protection

Product Application

• Power Electronics: Modules & inverters

• Control Systems: Sensors & ECUs

• Energy Storage: BMS-integrated battery packs

• Optoelectronics: LED drivers

• Connectivity: Networking modules

• Consumer Tech: Thermal-critical devices