S3X

Standard Edition

Reminder

3.0

0.5

217-220

Type3

Type4

Type5

Type6

20-45µm

20-38µm

10-25µm

5-20µm

SB6N

High reliability

3.5

6.0

0.5

202-210

TB

Low-melting

58

138

Type3

Type4

20-45µm

20-38µm

TAB

1

57

138-140

T4AB

0.4

57.6

138-140

S01XBIG

Low silver, anti-corrosion

0.1

0.7

1.6

+

211-227

S1XBIG

1.1

0.7

1.8

+

211-223

Halogen-free

S3X48/58-M500 series

• Stable printing performance for 0.4mm pitch QFP and 0.30mm φ CSP components

• Ensures excellent wettability on 0.4mm pitch QFP, 0.30mm φ CSP, and 0603 metric components

• Halogen-Free solder paste (Cl + Br: < 1500ppm)

• Reduced voiding achieved through innovative additive technology

• Enhanced heat resistance to prevent head-in-pillow (HIP) defects

• Enables continuous stencil printing and minimizes solder paste material waste

Halogen-free

S3X58-M650 series

• Fully Halogen-Free: Compliant with BS EN14582 standard (F, Cl, Br, I = 0ppm)

• Specialized Flux Formulation: Developed specifically for superior ICT testability

• Exceptional Low Voiding: Achieved through meticulously selected flux composition

• Complete Melting & Perfect Wetting: Ensures optimal solder joint formation

• Outstanding Performance on Micro Features: Delivers reliable results on micro pads (<0.4mm pitch) and miniature components (<0.25mm dia. CSP, 0603 metric chip)

Double-sided process

S3X58-A340

• Excellent Wettability on Micro Features: Ensures superior solderability for 0603 metric components and 0.25mm φ CSP pads.

• Maintains Initial Printability: Consistent performance after 30-minute printing interruptions.

• Extended Stencil Life: Sustains print quality through over 200 consecutive stencil wipes.

• Optimized for Double-Sided Assembly: Features an ideal rosin-based flux composition providing strong component tack force.

High reliability

SB6N/X58-M500SI

SB6N58-A730-3

• Enhanced Crack Resistance: Indium-enriched alloy formulation mitigates thermal stress and prevents solder joint cracking.

• Minimized Thermal Deformation: Maintains reliability in demanding harsh-environment applications through low CTE (Coefficient of Thermal Expansion).

• High-Precision Printing Performance: Superior continuous printability for ultra-fine pitch components (0.4mm/16mil) and CSPs (>0.3mm diameter), supporting wide printing speeds (20–80mm/sec) and extended stencil idle time.

• Halogen-Free Compliance: Meets BS EN14582 standard (Cl+Br: 0ppm).

Low cost and high reliability 

S01XBIG58-M500-4/B

S1XBIG58-M500-4/B

• Enhanced Reliability: Next-generation low-silver alloys outperform traditional SAC305 formulations in mechanical durability.

• Superior Micro-Joint Formation: Ensures complete melting and perfect wetting on ultra-fine-pitch components (>0.25mm CSP, 0603 metric chips).

• SAC305 Process Compatibility: Low melting point enables use in standard reflow profiles without process adjustments.

• Halogen-Free Compliance: Meets EN14582 standard (Cl+Br < 1500ppm).

Low-melting

TB/TAB/T4AB48/58-M742

• Ultra-Low Melt & Perfect Wetting: Achieves complete melting at 138°C with superior wetting performance.

• Precision Micro-Feature Compatibility: Engineered for ultra-fine-pitch components (<0.4mm) and miniature packages (>0.3mm CSP, 0603 metric chips).

Spot tin

S3X811-E150DN

• Jet Dispensing Optimized: Precision-formulated solder paste for advanced jet dispensing systems.

• Multi-Nozzle Compatibility & Control: Works with various jetting heads while maintaining accurate dot volume control.

• Halogen-Free Certified: Complies with BS EN14582 standard (Br+Cl < 1500ppm).