S3X

Standard Edition

Reminder

3.0

0.5

217-220

Type3

Type4

Type5

Type6

20-45µm

20-38µm

10-25µm

5-20µm

SB6N

High reliability

3.5

6.0

0.5

202-210

TB

Low-melting

58

138

Type3

Type4

20-45µm

20-38µm

TAB

1

57

138-140

T4AB

0.4

57.6

138-140

S01XBIG

Low silver, anti-corrosion

0.1

0.7

1.6

+

211-227

S1XBIG

1.1

0.7

1.8

+

211-223

Halogen-free

S3X48/58-M500 series

• Stable printing of 0.4QFP and 0.30 φ CSP

• Ensure good 0.4QFP and 0.30 φ， 0603 Component wettability

• Halogen free solder paste (Cl+Br:<1500ppm)

• Reduced occurrence of air bubbles through the use of new additives

• Improve heat resistance to prevent the incidence of defective pillows

• Achieve continuous printing and reduce solder paste waste

S3X58-M650 series

• Completely halogen-free: BS EN14582 (F, Cl, Br, I=0ppm)

• Special flux developed for good ICT testability

• Carefully selected flux composition can achieve excellent low bubble effect

• Complete melting and perfect wetting

• On the Micro Pad(<0.4mm pitch)And small parts(<0.25mm dia. CSP, 0603 chip)

Double-sided process

S3X58-A340

• Ensure that the micro solder pads (0603 components, 0.25mm φ Good solubility of CSP

• Capable of maintaining initial printability after a 30 minute interruption

• It can maintain printability even after 200 consecutive rolls

• Possesses the most suitable rosin composition for double-sided mounting, and has good component adhesion

High reliability

SB6N/X58-M500SI

SB6N58-A730-3

• The indium content helps the solder alloy resist thermal stress and prevent cracks in the solder joint

• Low thermal deformation, maintaining reliability in harsh application environments

• Ultra-fine pitch (0.4mm/16mil) and CSP (>0.3mm in diameter), ensuring excellent continuous printing capability, suitable for normal to fast printing (20 ~ 80mm/sec) and long stencil idle time

• Halogen-free standard (Cl+Br: 0ppm) BS EN14582

Low cost and high reliability 

S01XBIG58-M500-4/B

S1XBIG58-M500-4/B

• Low-silver alloys are more reliable than traditional low-silver alloys

• Perfect melting and wetting of ultra-fine pitch microcomponent dia (> 0.25mm. CSP, 0603Chip)

• Low melting point can be used in normal reflow oven temperature of SAC305

• Halogen-free standard (Cl+Br = less than 1500ppm EN14582

Low-melting

TB/TAB/T4AB48/58-M742

• Low melting point (138 ℃), complete melting and perfect wetting

• Ultra fine pitch (<0.4mm pitch), micro components (>0.3mm, dia. CSP, 0603 chip)

Spot tin

S3X811-E150DN

• Solder paste designed specifically for jet dispensing

• Compatible with multiple spray heads, precisely control the spray volume of each point

• Halogen free (Br+Cl:<1500ppm) BS EN14582