The main products include KOKI welding materials, Zymet glue, cleaning agent, TIM materials.
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The DY-PY series is suitable for filling needs of different thicknesses. Suitable for automated production equipment.
• Zero-Solvent Stability: Non-volatile formulation ensures long-term reliability
• Low-Pressure Conformability: Superior gap-filling at minimal compression
• Ambient Storage Ready: Stable performance at room temperature
• Single-Component Efficiency: No mixing required; slump-resistant application
• Critical Electronics: Chipsets, power modules, semiconductors
• Next-Gen Infrastructure: 5G networks, EV charging systems
• High-Performance Computing: Servers & data center equipment
• Automotive Innovation: Ruggedized vehicle electronics
• Consumer Tech: Thermal-sensitive consumer devices