Product description

The DY-PY series is suitable for filling needs of different thicknesses. Suitable for automated production equipment.

Product Features

• Zero-Solvent Stability: Non-volatile formulation ensures long-term reliability

• Low-Pressure Conformability: Superior gap-filling at minimal compression

• Ambient Storage Ready: Stable performance at room temperature

• Single-Component Efficiency: No mixing required; slump-resistant application

Product Application

• Critical Electronics: Chipsets, power modules, semiconductors

• Next-Gen Infrastructure: 5G networks, EV charging systems

• High-Performance Computing: Servers & data center equipment

• Automotive Innovation: Ruggedized vehicle electronics

• Consumer Tech: Thermal-sensitive consumer devices