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102020-07

Causes of "Solder Balls" and Prevention & Control Measures

I. Form of “solder balls” and relevant standards Standard 1: "No solder balls allowed" stipulated in the standard MIL-STD-2000;Standard 2: "Less than 5 per square inch" stipulated in the standard IPC-A-610C.In the IPC-A-610C standard, the m...

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072017-06

ZYMET

Board Level Underfills and Adhesives for High Reliability ApplicationsEffects of Board Level Materials　➢ Improve Drop and Shock Performance of POP’s, BGA’s, CSP’s & WLCSP’s 　➢ Affect Thermal Cycle Performance　　 — High CTE underfill reduces performance　　— ...

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122014-07

Metal Particle Size Selection

In the SMT manufacturing process, tin powder has a decisive influence on the quality of SMT manufacturing.There are many factors that affect the manufacturing quality, such as the choice of metal particle size, the manufacturing process of the stencil,The open...

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