Product Information

Excellent printability

High wetting

Low bubbles

Super low flux spatter

Disclaimer
This Production Information are the verification results of KOKI’s equipment and test conditions, no guarantees. Please conduct fill verification and optimization before use.

Product Features

◆ Alloy composition: Sn3.0Ag0.5Cu

◆ Equivalent or better wetting performance than halogen-containing solder paste

◆ Significantly reduces flux spatter

◆ Low bubbles in BTSs (e.g., Pw.Tr., GQN, LGA) and BGA

◆ No artificially added Halogen components, surely comply with completely halogenfree standard (Cl + Br = 0ppm): BS EN 14582

◆ Flux type: ROL0 (Cl + Br + I + F <= 0,05% / IPC J-STD-004B and 004C)

◆ Comply with RoSH, REACH standards

Features – All-in-one feature