Technical Support_DingSheng Technology (Shanghai) Co., Ltd

Technical Support

2025-03-04　|　Hits：149

We are committed to providing
the best support to resolve your
soldering challenges

To ensure our customer’s satisfaction in their manufacturing processes using our product, we offer a range of support services, including various product verification tasks and analysis of issues and defects that arise in daily production.

We are fully committed to providing comprehensive support, ensuring that our customers can use our products with confidence and achieve successful manufacturing outcomes.

Trust us to Address Your Concerns

Only certain boards or components are experiencing de-wetting, and the root cause is still unclear

There is unknown foreign object debris on the parts

Looking to optimize printing parameters to enhance soldering quality

Looking to optimize the reflow profile to reduce voiding

What is Technical Support?

Analytical Service

Our experienced engineers, specializing in joining technology, provide a technical approach with a comprehensive range of analytical, verification, and inspection equipment. We conduct analysis from physical, chemical, and electrical perspectives to identify root causes and deliver tailored solutions.

Process Optimization

We support the optimization of process conditions to ensure that Koki products achieve peak performance and quality. We replicate the customer's assembly Environment - such as printing conditions and reflow Profiles - on our test lines to tailor the process accordingly.

Key analysis and measurement items

External Observation

Observes Defective Point

Identifies Nature of Defect

SEM/EDX Analysis

Evaluates Quality of Plating

Identifies Contaminating Element

FT-IR Analysis

Analyzes Contaminating Element

Identifies Contaminating Substance

Cross Section Observation

Evaluates IMC (Intermetallic Compound)

Evaluates Crystalline Structure

Observes Defect (eg. Head-in-Pillow, Tombstone)

X-ray Analysis

Observes Voiding

Observes Head-in-Pillow Defects

Simulation

Simulates Wetting Behavior

Observes Warpage of Component and Board

Suggests Recommended Reflow Conditions

Joint Strength Test

Evaluates Shear Strength

Evaluates Pull Strength

Observes Breakage Mode

Thermal Shock Test

Evaluates Joint Durability

Observes Growth of IMC

SIR Test

Observes Electro-Migration in Thermohygrostat

Evaluates Voltage Applied SIR

Evaluates Drying at Normal Temp