Product Performance Table

• Product nameE series 　

• CompositionSn 3.0Ag 0.5Cu / Sn 3.5Ag /Sn 5Sb

• Melting Point（℃）217 - 219 / 221 / 238 - 241

• Halide content（%）0

• Flux TypeORL0

Power Electronics: A Pivotal Technology for Decarbonization

Power electronics, known for its efficient power conversion with minimal energy loss, has become a focal point in the drive towards decarbonization.
These devices often incorporate multiple solder joints, varying by structure and design,
necessitating solder materials with superior joint properties to ensure high quality and reliability.

Rosin/Resin Free Technology

The E series paste is designed and developed in such a way that all the constituents of the flux system can be evaporated During the reflow process.

This new flux formulation forms residue free joints which is extremely important for successful molding and wire bonding.

Unparalleled Low Voiding Performance

Solder joints in power devices require minimal voiding to ensure effective heat dissipation.
E series solder paste ensures that the flux volatilizes during the reflow process,
eliminating voids caused by residual flux regardless the type of solder alloy.

Streamline Your Production Process

E series are capable of eliminating the cleaning process required for a conventional rosing-based solder paste,
and the process steps such as placement of preform, attachment / detachment of fixture for solder preforms.

Cutting Half the Material Cost of Solder Preform

E series may reduce the material cost from preform by 50%.
Also, E series do not require a mold. It enables to cope with changes of product design

without high initial cost of making a new mold.