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Low Void Multi-feature Solder Paste for General Applications S3X58-HF1200

2025-06-10 | Hits:14

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The S3X58-HF1200 provides a multifunctional solution designed to address major assembly challenges, including voiding, wettability, flux splattering, printability, electrical reliability, and halogen-free requirements. In particular, the ‘Dual 2-Step’ Enhancement technology ensures exceptional soldering performance - all within a single, advanced formulation.

Feature

Provides a multifunctional solution suitable for large industrial fields, particularly meeting most of the requirements of the automotive industry

Realizes low voiding regardless component desgin

Powerful wetting as good as Halogen containing solder paste

Exhibits excellent print quality, which may reduce stencil cleaning frequency

Halogen free, no artificial addition of any halogen element

Product Performance Table

  • Product nameS3X58-HF1200

  • CompositionSn 3.0Ag 0.5Cu

  • Melting Point(℃)217 - 219

  • Particle Size(μm)20 - 38

  • Flux Content(%)11.9

  • Viscosity(Pa.s)190

  • Halide content(%)0

  • Flux TypeROL0(IPC J-STD-004D)

Struggling with Voiding or Wettability?

With advancements in PCB and component quality and performance in SMT industry, the demands on solder materials have also increased. In response to the industry’s growing need to address voiding and wettability challenges, we have newly developed a unique product featuring two groundbreaking technologies, the ‘2-Step Flux Gas Discharge Effect’ and ‘2-Step Activation Boost Effect’ delivering unprecedented level of assembly quality!

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Realizing the lowest void performance ever achieved!

The 2-step Flux Gas Discharge Effect, significantly reduces voids at both stages, ensuring effective void discharge.

Step-1: Active Coagulation Effect
Step-2: Active Outflow Effect

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Low void regardless component design and surface finish

Owing to the 2-step Flux Gas Discharge Effect, low voids are achieved even in components, like bottom electrodes, where voids are typically difficult to eliminate.

It also ensures consistent performance, regardless of component size and surface finish.


■ Voiding result of different components

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