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Board Level Underfills and Adhesives for High Reliability Applications
Effects of Board Level Materials
➢ Improve Drop and Shock Performance of POP’s, BGA’s, CSP’s & WLCSP’s
➢ Affect Thermal Cycle Performance
— High CTE underfill reduces performance
— Low CTE underfill enhances performance
Zymet Solutions:
Underfill, Edgefill & Edgebond
Underfill
Edgefill
Edgebond
Address：Room 804, No. 200. Xinghai Rd, Suzhou City, Jiangsu Frovince, China
Phone：0512-62567570
0512-62567686
Email：solder@dingshengsz.com
